Ob feem ntau lees txais cov ntsiab cai:
"Kev ua dej kub" cuam tshuam rau saum npoo ntawm cov khoom uas tau ua tiav nrog lub zog siab - kev sib zog laser nqaj (ib lub zog ntawm lub zog). Lub saum npoo nqus lub zog laser, tsim kom muaj cov txheej txheem ua kom sov nyob rau hauv thaj chaw ua kom sov li, ua rau muaj kev phom sij xws li deformation, melting, abration, thiab evaporation.
"Khaub thuas ua" koom nrog siv cov ntaub ntawv siab heev {0} lub zog (tsim hluav taws xob hauv nruab nrab Qhov kev ua si txias no yog qhov tseem ceeb hauv laser cim vim tias nws tsis yog thermal ablation, tab sis theej lub txias ablation txheej txheem uas tsis muaj kev puas tsuaj rau kev cuam tshuam ntawm "thermal kev puas tsuaj." Yog li, nws tsis kub los yog deform lub beglying txheej lossis ib puag ncig thaj chaw ntawm cov chaw ua tiav. Piv txwv li, hauv cov khoom siv hluav taws xob, cov neeg ua haujlwm lasers tau siv los tso cov tshuaj txhuam cov tshuaj txhuam cov tshuaj pleev cov tshuaj, tsim kom muaj kev sib luag me me hauv semiconductor substrates. Kev sib piv ntawm cov qauv sib txawv
Compared to inkjet marking, laser marking and engraving offer advantages in: a wide range of applications, allowing for permanent, high-quality marks on a wide range of materials (metal, glass, ceramics, plastic, leather, etc.). Nws kuj tshem tawm cov tub rog sab saum toj, ua rau tsis muaj kev cuam tshuam kev tawm tsam, thiab tsis corrode saum npoo.
Cov Ntawv Thov
Nws tuaj yeem engrave ntau yam ntawm tsis - nws yog xim hlau cov ntaub ntawv. Nws yog siv nyob rau hauv kev lag luam xws li cov khaub ncaws hnav khoom, ntim khoom siv dej cawv, khoom siv roj hmab, khoom plig hluav taws xob, thiab tawv tawv.
1. Nws tuaj yeem engrave hlau thiab ntau yam ntawm tsis - nws yog xim hlau cov ntaub ntawv. Nws yog tsim tshwj xeeb rau kev ua cov khoom lag luam uas xav tau cov khoom zoo thiab qhov ntsuas siab.
2. Nws yog siv nyob rau hauv kev lag luam xws li hluav taws xob hluav taws xob, cov khoom siv hluav taws xob, cov khoom siv hluav taws xob, tshuab hluav taws xob, tooj liab, khawm, magnesium, thiab zinc), rare metals and alloys (gold, silver, and titanium), metal oxides (all metal oxides are acceptable), special surface treatments (phosphating, aluminum anodizing, and electroplating), ABS materials (for electrical appliance housings and daily necessities), inks (translucent buttons and printed products), and epoxy resins (for packaging and insulating layers of electronic components).
